NIR Imaging

NIR confocal microscopy is ideally suited for use at various points within the failure analysis (FA) workflow because it is non-destructive and allows inspection of both Si bulk integrity and active level/layer areas.

This microscope system enables the user to inspect sub-surface images including MEMS device, 3D stacks, incoming wafers, photovoltaic, and wafer level CSP's with an astonishing level of precision. It also offers many capabilities and flexibility that are not available with traditional microscopes.