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NIR confocal microscopy is ideally suited for use at various points within the failure analysis (FA) workflow because it is non-destructive and allows inspection of both Si bulk integrity and active level/layer areas.
All systems feature powerful yet intuitive software permitting efficient data collection. Operation of the system, including system adjustments for illumination, magnification, XYZ stage position, and focus offset, are easily made. The software also features advanced image acquisition options, such as maximum Z projection, image stacking and image sequences. Data can be easily exported to popular imaging processing software such as ImageJ and Matlab.
By combining integrated motorization and autofocus with optional software, the systems can run automated acquisition routines. These routines may be applied to a single die or multiple dies, permitting the complete automation of the imaging process. The creation and execution of imaging recipes for wafers and both IC strip and tray packages is also possible. Once created, recipes can be executed against other individual samples or entire trays or strips of devices, ensuring accurate and repeatable inspection and greater overall efficiency.
To ensure the highest resolution and sharpest images, all system components, optical elements, and objectives have been designed and selected for optimal transmission of NIR wavelengths and imaging through Si. Features such as advanced photo detection and unique objective “correction collars”, coupled with component automation for precision motorization of the objectives, XY stage, ND filters, Z position, and illumination, ensure accurate, fast and simple image collection.
IRLC and LCSM systems include both a colour CMOS camera and NIR laser scanning confocal technology
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